Samsung plans to introduce HBM’s advanced RAM and logic chip packaging service in a vertical stack by the end of the year, US online IT publication Tom’s Hardware reports on June 17.
According to an announcement at Samsung Foundry Forum 2024, the service is expected to be available to customers by the end of the year. SAINT-D technology allows high-speed HBM RAM to be placed on top of a GPU or general purpose RAM.
This approach is very different from placing logic and memory in multiple blocks on a single substrate. The connections between the logic chip and the memory in this solution are much shorter. This allows you to increase data transfer speed, reduce leakage current and reduce power consumption.
Short conductors of internal connections between microcircuits will significantly reduce memory access latency. This is especially requested in data centers.
It is not yet clear when mass production of the first such device will begin. The semiconductor device must be designed to accommodate the new packaging method. None of the leading processor development companies have announced plans to use SAINT-D to launch their products.
Source: Rossa Primavera
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