Innotron has decided to build a production plant for high-performance processors with HBM memory in Shanghai, the American online computer technology publication Tom’s Hardware reported on June 28.
It is planned to invest 2.4 billion dollars (205.8 billion rubles) in production. The plant will focus on packaging processors on a single substrate with high-bandwidth memory (HBM).
Serial production is planned to begin in mid-2026. The target productivity is 30 thousand products per month. We are talking about server-based computing accelerators for artificial intelligence (AI) systems.
A subsidiary of Innotron is ChangXin Memory Technologies (CXMT), a Chinese memory manufacturer. CXMT previously announced plans to produce HBM memory. The parent company’s decision to set up a memory chip packaging plant confirms the previously announced plans.
Source: Rossa Primavera
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